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LANXESS ZA 200 KMPS Microetchant

Product Characteristics KMPS

  • Simple solution analysis and control
  • Extend the life of bath trough
  • High solubility, dissolves fast
  • Consistent and predictable etch rate
  • Excellent surface erosion patterns
  • Does not contain chelating agents, easy to clean
ZA 200™Etch(1.6K)
ZA 200™Etch(1.6K)
Etch-Rate Control
Etch-Rate Control

Manufacturing process of ZA 200 KMPS microetchant

  • pre-treatment for inner and outer layer
  • pre-treatment for PTH
  • pre-treatment for copper plating
  • pretreatment for OSP process
  • pre-treatment for ENIG
  • pre-treatment for Gold plating
  • pre-treatment for Immersion tin
  • pre-treatment for Immersion silver
  • pre-treatment for FPC board process
Application Performance of ENIG Process
ENIG Online Production Parameters
Operation Type Vertical rack (automatic production line)
Circulation State bubble agitation by pump
Operation Temperature 32℃
Operation Time 105 sec
Etching Rate 40±10μ"
Tank Volume 400L
化鎳金製程實績應用
  • ZA 200 is easy to clean, no need for addition acid wash
  • Can directly replace SPS or HO microetching system, good compatibility
ZA200微蝕劑生產流程