Surcoat T / TX is an organic copper protective agent that has excellent heat resistance and moisture resistance properties. It is a water-soluble preflux specifically designed for heat and welding resistance of lead-free (Sn / Cu / Ag) solder surface of the printed circuit board.
Surcoat T / TX is also an organic OSP specifically designed for the lead-free soldering process that can withstand the impacts of high-temperature lead-free soldering (Peak Temp. 260 ℃, 3 times or more) several times and still retains excellent copper solder surface resistance (0.9 ~ 1.1ø aperture PTHs, 99 ~ 100% rate on the tin).

Product Advantages

low manufacturing cost, extend the life of the bath
Surcoat TX is suitable for copper/gold mix board, and can operate without taping
excellent flatness and pore uniformity
bath solution is less prone to crystallization and does not produce oil
suitable for surface copper treatment of wafer package
great heat resistance -(260℃/ IR-Reflow more than 3 times)

short processing time for T/TX bath
maximum allowable limit of copper ions in a bath
comply with environmental requirements
compatible with disposable processes
simple procedures and reduces cost

Surcoat OSP Operations flowchart

Surcoat OSP Operations flowchart

Comparison chart of tolerance of copper ions in anti-gold solution

Surcoat OSP Operation Flowchart