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SANWA New Generation of heat resistant lead-free organic solderability preservatives (Cu-Coat GVIII)

Product Description
Cu-Coat GVIII is a new product developed by the Sanwa Laboratory Ltd. that combines its advanced technology capabilities:
1.Excellent pass rate for ICT (In Circuit Test) electrometric measurements.
2.Has anti-galvanic effect properties.

Cu-Coat GVIII has excellent heat and moisture resistance characteristics and is a new generation heat resistant lead-free OSP specifically designed for the surface treatments of printed circuit board.
Product advantages
  • passes the ICT test after OSP
  • has anti-galvanic effect properties, no color differences after IR
  • can produce copper/gold mixed boards directly, no need for taping
  • excellent flatness and pore uniformity
  • bath solution is less prone to crystallization and does not produce oil
  • uitable for surface copper treatment of wafers
  • great heat resistance -(260℃/ IR- more than 3 times of Reflow
  • comply with environmental requirements
  • compatible with disposable processes
ICT (After OSP Film Formed)
Passes the ICT test
新世代耐高溫無鉛有機保焊劑ICT
Comparison of the thickness of anti-galvanic film
Test parameters:
1.Test pattern：2.0cm × 2.5cm(10cm)double-sided copper substrate
2.Cu/Au Plating ratio； 1:1
Cu-Coat GVIII/Other brands (film thickness of bare copper board)：0.25 μm

The ratio of GVIII film thickness can be kept close to 1.0 on bare copper board or copper/gold mixed board
新世代耐高溫無鉛有機保焊劑_抗賈凡尼的膜厚比例比較
Cu-Coat GVIII Operation Flowchart
新世代耐高溫無鉛有機保焊劑_作業流程