Electroless nickel Plating kit

Nilessine EN-91 Alkainek Electroless nickel Plating solution

Photoresist Stripper

De-Waxing Agents

Chloroauric Acid / Palladium chloride / Aurosine

Gold Plating Water

Gold Etching Eolution

Titanium tungsten etching solution

Titanium etching solution

Nickel etching solution

Silver etching solution

ZA200 Microetchant

High-Aspect-Ratio Through-Hole Electroplated Copper

General Purpose Electroplated Copper

Blind-Hole Electroplated Copper

Antioxidants CP-100

Copper Surface Cleaning Agent

Copper Surface Leveling Agent

Thermal Release Tape

Stripping Solution

Copper Etching Agent EZ-301

Chemical Bonding

Specialty Chemicals

Stannous Chloride

Palladium Sulfate Solution

Palladium Chloride

Rhodium Electroplating Solution and Gloss Agent

HF(Hydrofluoric Acid)

Phosphoric Acid

Alpha Hydroxy Acid

NMP(N-methylpyrrolidone)

Graphene Lubricant Additive

Alloy Glass Release Agent

Antistatic Fluid

Fluorine-Free Water Repellent

OCP Thickening Agent

Environmentally Friendly Water Remover

Biodegradable Materials

Passive components

Neutral Electroplated Tin

Neutral Electroplated Nickel

Cutting Film (pyrolytic type)

Conductive Carbon Coating Paste - Carbon Coated Aluminum Foil

Fast-Drying Spray Protective Ink

Slicing Grinding Polishing materials

Slicing/coolant

Slicing detergent

Grinding Powder

Silicon Polishing CMP Slurry

Aluminum Polishing CMP Slurry

Polishing CMP PAD

Polishing detergent

Copper Surface Leveling Agent

Agency Brand

Echem

Product Applications

Low etching degree, effective removal of copper slag at the bottom of the hole caused by drilling, copper tumor at the hole, overhang, copper surface leveling, copper plating quality improvement, copper plating uniformity warranted

Product Specifications

Powder 25KG/barrel. For more details, please contact the sales staff of E-CHEM

銅面整平劑

銅面整平劑