Electroless nickel Plating kit

Nilessine EN-91 Alkainek Electroless nickel Plating solution

Photoresist Stripper

De-Waxing Agents

Chloroauric Acid / Palladium chloride / Aurosine

Gold Plating Water

Gold Etching Eolution

Titanium tungsten etching solution

Titanium etching solution

Nickel etching solution

Silver etching solution

ZA200 Microetchant

General Purpose Electroplated Copper

Blind-Hole Electroplated Copper

High-Aspect-Ratio Through-Hole Electroplated Copper

Antioxidants CP-100

Copper Surface Cleaning Agent

Copper Surface Leveling Agent

Thermal Release Tape

Stripping Solution

Copper Etching Agent EZ-301

Chemical Bonding

Specialty Chemicals

Stannous Chloride

Palladium Sulfate Solution

Palladium Chloride

Rhodium Electroplating Solution and Gloss Agent

HF(Hydrofluoric Acid)

Phosphoric Acid

Alpha Hydroxy Acid

NMP(N-methylpyrrolidone)

Graphene Lubricant Additive

Alloy Glass Release Agent

Antistatic Fluid

Fluorine-Free Water Repellent

OCP Thickening Agent

Environmentally Friendly Water Remover

Biodegradable Materials

Passive components

Neutral Electroplated Tin

Neutral Electroplated Nickel

Cutting Film (pyrolytic type)

Conductive Carbon Coating Paste - Carbon Coated Aluminum Foil

Fast-Drying Spray Protective Ink

Slicing Grinding Polishing materials

Slicing/coolant

Slicing detergent

Grinding Powder

Silicon Polishing CMP Slurry

Aluminum Polishing CMP Slurry

Polishing CMP PAD

Polishing detergent

Copper Etching Agent EZ-301

Agency Brand

Echem

Product Description

EZ-301 is suitable for hydrogen peroxide/sulfuric acid batch composition and is able to significantly inhibit the Under Cut production compared to the mSAP, SAP and RDL manufacturing processes, Fine Line 25/25~12/12.

Product Description

Excellent selectivity to inhibit line side corrosion
Square line shape
Excellent resistance to chloride ion

Product Specifications

Customized manufacturing services available according to customer’s needs. For more details, please contact the sales staff of E-CHEM