Product Applications
PThe polyimide film (PIF) is a kind of polymer film with favorable thermal resistance and superior physical, chemical and electrical properties. Its operation may be performed in a wide temperature range, from as low as -452°F (- 269°C) to as high as + 436°F (+2 60°C), or even up to + 752°F (+ 400°C) if operated for a short period of time. In addition, it is able to resist atomic radiation.
The polyimide film is a unique material with the highest performance, insulation and temperature resistance among all polymer materials nowadays
- Insulation layer exclusive for generators, wires and cables, capacitors, etc.
- Substrate materials for pressure sensitive adhesive tapes such as F46 (FEP)
- It is suitable to be used in the insulation layer of various flexible printed circuit boards (F-PCB)
- Heat-resistant film for IC packaging
