Semiconductor
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Slicing Grinding Polishing materials

Nilessine EN-91 Alkainek Electroless nickel Plating solution

Product Introduction

The mode of operation for continuous electroless plating is automatically replenishing and control nickel in order to maintain the components concentration and pH of reactants in the bath, as well as the thickness and amount of phosphorus of the finishing product can be kept stable. Thus, when compared to the single bath eletroless plating, the differences are the variances between batches are lowered, human factors are reduced, the mode of operation is simpler, and the volume of monolithic waste and cost per chip are significantly reduced.
The property of nickel v.s wafer loading
無電鍍鎳組建浴方式
Operating information for continuous electroless plating
單槽與連續式無電鍍鎳比較
Photographs of continuous electroless plating equipment
連續式設備相片

E-CHEM Taiwan Main Office
陳相穎 Lana Chen
Tel:+886-3-3653300 #4207
M.P:+886- 978513605
E-mail:lana.chen@echemsemi.com

E-CHEM Shanghai Corp Dongguan Office
徐世綱 Kenny Hsu
Tel:+886-3-3653300 #4203
M.P:+886- 88213093
E-mail:kenny.hsu@echemsemi.com