General Purpose Electroplated Copper

Agency Brand

MELTEX

Product Applications

Broad-spectrum applications, suitable to be used in the copper sulfate plating additives for insoluble anodes
  • Superior throwing power at high current density
  • Super throwing power under high-aspect-ratio through-holes
  • Electroplating film possessing low internal stress, high ductility and malleability, and thermal shock resistance
  • Pattern line with superior uniformity

Product Specifications

Additive Anode (copper ion supplement) Application Target
Double formulation Insoluble anode (copper oxide powder) Broad-spectrum applications, suitable to be used in the plating additives for insoluble anodes. Pattern line with superior uniformity. Multilayer board
HDI
FPC