Semiconductor
PCB Chemicals
Specialty Chemicals
Passive components
Slicing Grinding Polishing materials

Blind-Hole Electroplated Copper

Agency Brand

MELTEX

Product Applications

SVF is appropriate as the copper sulfate electroplating additive applicable for the SAP and MSAP manufacturing processes
  • Superior hole filling performance at low film thickness
  • Superior hole filling performance at high current density
  • Superior throwing power applicable for through-hole substrates
  • Electroplating film possessing low internal stress, high ductility and malleability, and thermal shock resistance

Product Specifications

Additive Anode (copper ion supplement) Application Target
Triple formulation Insoluble anode (copper oxide powder) Applicable for SAP and MSAP manufacturing processes Substrate
HDI
FPC