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Thermal Release Tape

Thermal Release Tape Agency Brand

Echem

Thermal Release Tape Product Applications

The pyrolytic adhesive tap produces the de-bonding reaction at the high temperature set and detaches from the original adhesive after the manufacturing process ends. It can be applied for low board thickness to resolve the board jamming and warping issues with the production capacity improved

Thermal Release Tape Product Description

  • Product application manufacturing process: coreless substrate, thin core substrate, embedded substrate, RTR FPC
  • The thin core substrate under 100um can replace frames and fixtures
  • FPC able to replace plating-resistant film, supporting tape, or band plate

Thermal Release Tape Product Features

  • Superior chemical resistance
  • Stable adhesive strength
  • Pyrolysis without viscosity and residual adhesive
  • Stiffness enhanced and warpage eliminated
  • Capacity doubled and board folding reduced
  • Halogen free, acrylic adhesive does not contain silicon

Thermal Release Tape Product Specifications

Customized manufacturing services available according to customer’s needs. For more details, please contact the sales staff of E-CHEM