Semiconductor
PCB Chemicals
Specialty Chemicals
Passive components
Slicing Grinding Polishing materials

High-Aspect-Ratio Through-Hole Electroplated Copper

Agency Brand

MELTEX

Product Applications

ACP is suitable for the copper sulfate plating additives of soluble anodes with high aspect ratios
  • Superior throwing power over a wide range of current densities
  • Superior throwing power under high-aspect-ratio through-holes
  • Electroplating film possessing low internal stress, high ductility and malleability, and thermal shock resistance

Product Specifications

For more details, please contact the sales staff of E-CHEM.