Semiconductor
PCB Chemicals
Specialty Chemicals
Passive components
Slicing Grinding Polishing materials

Nicke etching solution

Product Introduction

It is used to etch only the nickel metal surface under the nitric acid system and is used in the nickel surface treatment process. While removing the nickel plating, adding a special protective agent can effectively improve the metal etching selectivity ratio and achieve selective etching performance.

Operation suggestions

Operating parameters Immersion work
Single dose medicine Use directly by soaking
Operating temperature (℃) 35～40
Etching speed 80~120 Å/sec
Silver metal corrosion rate 20~30 Å/sec
Titanium metal corrosion rate < 0.1 Å/sec
Achievements
鎳蝕刻液成果
鎳蝕刻液成果2

E-CHEM Taiwan Main Office
陳相穎 Lana Chen
Tel:+886-3-3653300 #4207
M.P:+886- 978513605
E-mail:lana.chen@echemsemi.com

E-CHEM Shanghai Corp Dongguan Office
徐世綱 Kenny Hsu
Tel:+886-3-3653300 #4203
M.P:+886- 88213093
E-mail:kenny.hsu@echemsemi.com