Product Description
Surcoat T / TX is an organic copper protective agent that has excellent heat resistance and moisture resistance properties. It is a water-soluble preflux specifically designed for heat and welding resistance of lead-free (Sn / Cu / Ag) solder surface of the printed circuit board.
Surcoat T / TX is also an organic OSP specifically designed for the lead-free soldering process that can withstand the impacts of high-temperature lead-free soldering (Peak Temp. 260 ℃, 3 times or more) several times and still retains excellent copper solder surface resistance (0.9 ~ 1.1ø aperture PTHs, 99 ~ 100% rate on the tin).
Product Advantages
- low manufacturing cost, extend the life of the bath
- Surcoat TX is suitable for copper/gold mix board, and can operate without taping
- excellent flatness and pore uniformity
- bath solution is less prone to crystallization and does not produce oil
- suitable for surface copper treatment of wafer package
- great heat resistance -(260℃/ IR-Reflow more than 3 times)
- short processing time for T/TX bath
- maximum allowable limit of copper ions in a bath
- comply with environmental requirements
- compatible with disposable processes
- simple procedures and reduces cost
Surcoat OSP Operations flowchart
Surcoat OSP Operations flowchart
Comparison chart of tolerance of copper ions in anti-gold solution
Surcoat OSP Operation Flowchart