About E-CHEM
Company Profile
Form the Chairman
Business Philosophy
Quality Policy
Products
Semiconductor
TRANSENE
PureSAB
Electroless nickel Plating kit
Nilessine EN-91 Alkainek Electroless nickel Plating solution
Photoresist Stripper
De-Waxing Agents
Soloper D/ NBA
Chloroauric Acid / Palladium chloride / Aurosine
Precursor
Gold Plating Water
Gold Etching Eolution
Titanium tungsten etching solution
Titanium etching solution
Nickel etching solution
Silver etching solutio
PCB Chemicals
Surcoat
Cu-Coat GVIII
ZA200 Microetchant
High-Aspect-Ratio Through-Hole Electroplated Copper
General Purpose Electroplated Copper
Blind-Hole Electroplated Copper
Antioxidants CP-100
Copper Surface Cleaning Agent
Copper Surface Leveling Agent
Thermal Release Tape
Stripping Solution
Copper Etching Agent EZ-301
Chemical Bonding
Specialty Chemicals
BTA
Stannous Chloride
DMAB
Palladium Sulfate Solution
Palladium Chloride
Rhodium Electroplating Solution and Gloss Agent
HF(Hydrofluoric Acid)
Phosphoric Acid
Alpha Hydroxy Acid
NMP(N-methylpyrrolidone)
Graphene Lubricant Additive
Alloy Glass Release Agent
Antistatic Fluid
Fluorine-Free Water Repellent
OCP Thickening Agent
Environmentally Friendly Water Remover
PI Film
Biodegradable Materials
Iron Activator
Passive components
Neutral Electroplated Tin
Neutral Electroplated Nickel
Cutting Film (pyrolytic type)
Conductive Carbon Coating Paste - Carbon Coated Aluminum Foil
Fast-Drying Spray Protective Ink
Slicing Grinding Polishing materials
Slicing/coolant
Slicing powder
Slicing detergent
Grinding Powder
Dispersant
Diamond Slurry
Silicon Polishing CMP Slurry
Aluminum Polishing CMP Slurry
Polishing CMP PAD
Polishing detergent
Social Activity
Chemical Knowledge
Human Resource
Careers
Compensation & Benefits
Contact us
Cooperation
Business Contacts
繁體中文
English
简体中文
About E-CHEM
Company Profile
Form the Chairman
Business Philosophy
Quality Policy
Products
Semiconductor
TRANSENE
PureSAB
Electroless nickel Plating kit
Nilessine EN-91 Alkainek Electroless nickel Plating solution
Photoresist Stripper
De-Waxing Agents
Soloper D/ NBA
Chloroauric Acid / Palladium chloride / Aurosine
Precursor
Gold Plating Water
Gold Etching Eolution
Titanium tungsten etching solution
Titanium etching solution
Nickel etching solution
Silver etching solution
PCB Chemicals
Surcoat
Cu-Coat GVIII
ZA200 Microetchant
General Purpose Electroplated Copper
Blind-Hole Electroplated Copper
High-Aspect-Ratio Through-Hole Electroplated Copper
Antioxidants CP-100
Copper Surface Cleaning Agent
Copper Surface Leveling Agent
Thermal Release Tape
Stripping Solution
Copper Etching Agent EZ-301
Chemical Bonding
Specialty Chemicals
BAT
Stannous Chloride
DMAB
Palladium Sulfate Solution
Palladium Chloride
Rhodium Electroplating Solution and Gloss Agent
HF(Hydrofluoric Acid)
Phosphoric Acid
Alpha Hydroxy Acid
NMP(N-methylpyrrolidone)
Graphene Lubricant Additive
Alloy Glass Release Agent
Antistatic Fluid
Fluorine-Free Water Repellent
OCP Thickening Agent
Environmentally Friendly Water Remover
PI Film
Biodegradable Materials
Iron Activator
Passive components
Neutral Electroplated Tin
Neutral Electroplated Nickel
Cutting Film (pyrolytic type)
Conductive Carbon Coating Paste - Carbon Coated Aluminum Foil
Fast-Drying Spray Protective Ink
Slicing Grinding Polishing materials
Slicing/coolant
Slicing powder
Slicing detergent
Grinding Powder
Dispersant
Diamond Slurry
Silicon Polishing CMP Slurry
Aluminum Polishing CMP Slurry
Polishing CMP PAD
Polishing detergent
Social Activity
Chemical Knowledge
Human Resource
Careers
Compensation & Benefits
Contact us
Cooperation
Business Contacts
Language
繁體中文
English
简体中文
Semiconductor
TRANSENE
PureSAB
Electroless nickel Plating kit
Nilessine EN-91 Alkainek Electroless nickel Plating solution
Photoresist Stripper
De-Waxing Agents
Soloper D/ NBA
Chloroauric Acid / Palladium chloride / Aurosine
Precursor
Gold Plating Water
Gold Etching Eolution
Titanium tungsten etching solution
Titanium etching solution
Nickel etching solution
Silver etching solution
PCB Chemicals
Surcoat
Cu-Coat GVIII
ZA200 Microetchant
High-Aspect-Ratio Through-Hole Electroplated Copper
General Purpose Electroplated Copper
Blind-Hole Electroplated Copper
Antioxidants CP-100
Copper Surface Cleaning Agent
Copper Surface Leveling Agent
Thermal Release Tape
Stripping Solution
Copper Etching Agent EZ-301
Chemical Bonding
Specialty Chemicals
BTA
Stannous Chloride
DMAB
Palladium Sulfate Solution
Palladium Chloride
Rhodium Electroplating Solution and Gloss Agent
HF(Hydrofluoric Acid)
Phosphoric Acid
Alpha Hydroxy Acid
NMP(N-methylpyrrolidone)
Graphene Lubricant Additive
Alloy Glass Release Agent
Antistatic Fluid
Fluorine-Free Water Repellent
OCP Thickening Agent
Environmentally Friendly Water Remover
PI Film
Biodegradable Materials
Iron Activator
Passive components
Neutral Electroplated Tin
Neutral Electroplated Nickel
Cutting Film (pyrolytic type)
Conductive Carbon Coating Paste - Carbon Coated Aluminum Foil
Fast-Drying Spray Protective Ink
Slicing Grinding Polishing materials
Slicing/coolant
Slicing powder
Slicing detergent
Grinding Powder
Dispersant
Diamond Slurry
Silicon Polishing CMP Slurry
Aluminum Polishing CMP Slurry
Polishing CMP PAD
Polishing detergent
Antistatic Fluid
Agency Brand
ECHEM
Product Applications
Physically conductive, not affected by environmental humidity
No decay issues under prolonged use
Not reactive with substrates with good compatibility with polymers
Antistatic requirements achievable at a low cost with a small quantity added
Certain transmittance maintained without affecting penetration
No powder falling issue compared with other antistatic coating materials added with conductive carbon black
Product Specifications
20KG/barrel - 200KG/barrel For more details,
please contact the sales staff of E-CHEM