Semiconductor
PCB Chemicals
Specialty Chemicals
Traditional materials
Passive components
Slicing Grinding Polishing materials

Polishing Detergent

Product Introduction

Cleaning after grinding is the most critical process in the polishing and grinding process. A good cleaning agent can provide excellent cleaning power to achieve a clean wafer with low defects and no corrosion.

Applications

Applicable to Prime Si, Reclaim Si, SiC, III-V, Cu CMP, Oxide CMP, Pad clean.

Product Specifications

For detailed information, please contact our company's sales personnel。

E-CHEM Taiwan Main Office
陳相穎 Lana Chen
Tel:+886-3-3653300 #4207
M.P:+886- 978513605
E-mail:Lana.Chen@echemsemi.com